Kulicke and Soffa Model 4219 Deep Cavity (access) Wedge Bonder
Manual wire bonder system for hybrids, microwave devices, integrated circuits, discrete devices. Unique wire feed, wire tear system allows for bonding in deep cavities. For use with aluminum or gold wire with 18-50 micron diameter or gold ribbon with thickness of 25-125 micron. 1/2” or 2” spool size. Chessman and manual Z control for positioning. 10-160 grams bond force. 10-200 millisec bond time. Heated workholder up to 400 degree C set point. Total system weight of 110 lb. 110 volt. Original workholder and manual will be supplied also. System has been used less than 10 hours. Additional specifications can be provided if required. All tips(wedges) and aluminum-1% silicon wire(various diameters) on hand will be provided also with equipment. Equipment powers up. If required, wedge bonds will be made with aluminum wire before shipment to show capability. Originally purchased new for $16,626.00.
