The ultrasonic welding process is a solid state (no melting of materials) welding process. The weld is produced by the application of high frequency (60KHz) vibratory energy as the parts are held together with force. The “scrubbing” action that occurs at the weld interface displaces metallic oxides, foreign materials, etc. to expose fresh clean metallic surfaces for bonding. This process is widely used in the micro-electronics industry for attachment to IC chips.