Micro-soldering/brazing processes use low melting temperature alloys to join materials. The parts to be joined do not melt, instead the solder/braze materials melt to effect a metallurgical bond. A variety of methods can be used at the joint interface to melt the solder/braze materials including resistance, infra-red, laser, and thermal conduction.
0.003" copper wires
soldered to gold pads
High Magnification of parallel
gap soldered joint
- Inexpensive equipment.
- No melting of materials other than the solder/braze so no weldability issues between the base materials to be joined.
Solder/Braze Materials In Stock:
Approximately 50 different solder alloys. Cusil, nicusil, nioro, silver, ti-cusil, georo, gold-tin, silcoro, aircosil, incuro, incusil and lithobraze brazing alloys.
Equipment/techniques for soldering/brazing wires/foils as thin as 0.0005".
Fluxless techniques for soldering/brazing.
- Parallel gap welding head up to 10 pounds force
- Dual head reflow soldering system fully automated.
- Infra-red solder reflow system.
- Same power supplies and welding heads as the resistance welding can be used for the soldering/brazing.
Precision Joining Technologies, P.O. Box 531, Miamisburg, OH 45343-0531
Ph (937)865-4051 FAX (937)865-3666
Copyright 2003 Precision Joining Technologies, Inc. All Rights Reserved. Photos may NOT be downloaded, copied, stored, posted on other sites, or redistributed except by the written consent of Precision Joining Technologies, Inc.